Renesas Eastern Japan Semiconductor Inc
Equipment

SiP Bonder

HOMEEquipment>SiP Bonder

DB-800

DB-800, 300mm die bonder developed most suitably for SiP assembling.

Features

  • High Productivity
    20% higher UPH compared to our current model DB-700. (more than UPH10,000)
  • New vision systems
    High resolution vision systems Lighting technology effectively designed for warpage of thin die.
  • New operating systems
    Newly developed user friendly screen operating systems
DB-800
 

Thin Die Bonding Technology

  • Realizes thin die pick up by using the ultrasonic pick up and multi-stage pick up.
  • Realizes high precision paste application by using the non-contact nozzle height control by laser length measurement and mechanical dispenser.
  • Realizes various thermo-pressure bonding mounting by using the substrate heater/collet heater.
 

Specification

Item Description
Bonding Speed 0.32s/die(Machine cycle time)
Bonding accuracy X,Y : ±15µm
θ : ±0.5°(3σ)
Work dimension Lead frame Width : 25-90mm / Length : 100-250mm
Wafer 300mm, 200mm(Optional)
Die 0.8*0.8mm - 25*25mm(Optional)
Dimensions (W)1,900*(D)1,430*(H)1,600[mm]
Weight About 1,600kg

DB-700

High speed and high precision flexible bonder applicable to SiP (System in Package) assembly with 300mm wafer handling capability.

Features

  • The world's smallest class of die bonder for 300mm wafer.(Space saving, lightweight and low vibration design)
  • High UPH is realized by the new bonding head mechanism.
  • Applicable to the automated production of stacked packages, by connecting multiple equipment.
  • Equipment with the CE marking is selectable.
DB-700
 

Product lineup

  • DB-700AD: for high quality and productivity
  • DB-700ADF: with adhesive film singualtion
  • DB-700ADL: with film laminating function
 

Specification

Item Description
Bonding Speed 0.35s/die(Machine cycle time)
Bonding accuracy X,Y : ±25µm
θ : ±0.5°(3σ)
Work dimension Lead frame Width : 25-90mm / Length : 100-250mm
Wafer 300mm, 200mm(Optional)
Die 0.5*0.5mm-25*25mm(Optional)
Dimensions (W)1,960*(D)1,490*(H)1,630[mm]
Weight About 1,570kg

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