CM-700
High precision and high speed mounter for CSP/LOC assembly with 300mm wafer handling capabilities.
Features
- Applicable to 300mm and 200mm wafers.
- Applicable to µBGA/BOC assembly for the next-generation DRAM package.
- Utilizes various die mount modes appropriate for many packages.
- "µBGA" is a registered trademark of Tessera, Inc.
Specification
| Item | Description | |
|---|---|---|
| Mount speed | BOC/LOC : 1.2s/die µBGA/CSP : 2.1s/die ※Depends on bonding condition |
|
| Mount accuracy | BOC/LOC:X,Y ±38µm (3σ) µBGA/CSP:X,Y ±8µm (3σ) |
|
| Work dimension | Lead frame | Width : 2590mm/Length : 145250mm |
| Wafer | 300mm, 200mm(Option) | |
| Die | 3*3mm25*25mm | |
| Dimensions | (W)2,370*(D)1,420*(H)1,720[mm] | |
| Weight | 2,500kg | |
CM-700X
High precision and high speed mounter for CSP/LOC assembly with 300mm wafer handling capabilities.
Features
- Applicable to 300mm and 200mm wafers.
- Applicable to µBGA/BOC assembly for the next-generation DRAM package.
- Flexible die mount mode selections are appropriate for various packages.
- "µBGA" is a registered trademark of Tessera, Inc.
Specification
| Item | Description | |
|---|---|---|
| Mount speed | BOC/LOC : 1.0s/di µBGA/CSP : 1.9s/die Depends on bonding condition. |
|
| Mount accuracy | BOC/LOC : X,Y ±38µm (3σ) µBGA/CSP : X,Y ±8µm (3σ) |
|
| Work dimension | Lead frame | Width : 2590mm/Length : 145250mm |
| Wafer | 300mm, 200mm (Option) | |
| Die | 3*3mm25*25mm | |
| Dimensions | (W)2,370*(D)1,420*(H)1,720[mm] | |
| Weight | 2,500kg | |
CM-700R/RS
High precision and high speed mounter for µBGA/CSP assembly with 300mm wafer handling capabilities.
Features
- Applicable to 300mm and 200mm wafers.
- Applicable to µBGA/CSP high precision assembly for the next-generation DRAM package.
- Utilizes various die mount modes appropriate for many packages.
- "µBGA" is a registered trademark of Tessera, Inc.
Specification
| Item | Description | |
|---|---|---|
| Mount speed | 700R µBGA/CSP : 2.8s/die 700RS µBGA/CSP : 5.5s/die Depends on bonding condition. |
|
| Mount accuracy | 700R µBGA/CSP : X,Y ±10µm (3σ) 700RS µBGA/CSP : X,Y ±5µm (3σ) Depends on frame accuracy. |
|
| Work dimension | Tape width | 32mm, 48mm (Wide), 70mm (Super wide) |
| Wafer | 300mm, 200mm (Optional) | |
| Die | 3*3mm25*25mm | |
| Dimensions | (W)3,300*(D)1,420*(H)1,800[mm] | |
| Weight | 2,800kg | |
