Our leading-edge module technology supports your extension to IT (information technology) business. Our module products support the need to make products smaller, thinner, and more reliable through our engineering process specific to semiconductor manufacturers cultivated through long experience, support for a variety of processes, and material selection.
Smaller, Thinner, Faster, and Systematized Products
- Flip chip technology, MCM
- Multi chip jisso technology, multimedia cards
- Wire bonding technology, crystal module
- Development TAT deduction, MC-COF/camera modules
Higher Power
- Heat-dissipation structure processes, power modules, automotive modules
Radio-Frequency Characteristics
- Characteristics tuning technology
- High frequency testing technology, RF modules
Larger Memory Capacities
- TCP module technology, memory modules
- Flash card ATA/CF
- Silicone disks
