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This illustration shows about package size D,E,A in the table.

Tape Type Packages

●：In mass production　　○：Under development　　□：Under planning

TYPE	Tape Width
	35mmSW	48mmSW	70mmW
TCP	●	●	●
COF	●	●	●

PKG	PKG Size(mm)			Ball Pitch (mm)	Pin Count
	D	A	E		120	184	216	264	352	400	480
T-BGA	13	13	V	0.5		●
	15	15	V	0.5			●
			T	0.8	●
	18	18	V	1.0				●
			T	0.8			●
	21	21	T	0.8				●
	23	23	L	0.8					●
	31	31	-	1.0						●	●

Substrate Type Packages

●：In mass production　　○：Under development　　□：Under planning

TYPE		Body Thickness A (mm Max)
LGA	BGA
LFLGA	LFBGA	1.7
TFLGA	TFBGA	1.2
VFLGA	VFBGA	1.0
WFLGA	-	0.8
UFLGA	UFBGA	0.65
XFLGA	XFBGA	0.5

PKG	PKG Size(mm)			Ball Pitch (mm)	Pin Count
	D	E	A		44	57	65	72	85	96	97	104	108	113	119	128	132	156	164	176	181	208	256	264	277	281	324	329	480	676
BGA	4	4	-	0.5	●
	5	5	-	0.5	●	●		●
	6	6	-	0.4																	●
			-	0.5			●		●		●
	7	7	-	0.5												●
	8	8	-	0.5								●					●
			-	0.65						●		●		●
	10	10	-	0.8									●
	12	12	-	0.8														●
	13	13	-	0.65																					●	●
			-	0.8																●
			-	1.0									●
	14	22	-	1.27											●
	14	14	-	1.0															●
	15	15	-	0.5																									●
			-	0.8																							●
	17	17	-	1.0															●			●
	18	18	-	0.65																			●	●
	19	19	-	0.8																							●
	21	21	-	1.0																								●
	27	27	-	1.0																										●

PKG	PKG Size(mm)			Land Pitch (mm)	Pin Count
	D	E	A		56	64	72	80	96	104	113	120	132	144	156	168	176	183	208	242	243	252	304
LGA	5	5	-	0.5	●		●
	6	6	-	0.5		●
	7	7	-	0.5				●		●		●
	8	8	-	0.5									●
			-	0.8				●
	8	12	-	0.8					●
	9	9	-	0.8		●
	9.5	9.5	-	0.65											●
	10	10	-	0.5							●							●
			-	0.8						●
	11	11	-	0.50
	12	12	-	0.5						●							●
			-	0.8
	13	13	-	0.5																			●
			-	0.65													●			●
			-	0.8										●
	14	14	-	0.65																			●
	15	15	-	0.8												●			●
	18	18	-	0.8																		●
	20	20	-	0.8																	●

Mold Array Packages

●：In mass production　　○：Under development　　□：Under planning

TYPE	PKG	PKG Size(mm)			Lead Pitch (mm)	Pin Count
		D	E	A		4	6	8	12	16	24	32	48	56	64
Electoric Forming Lead	SON1010	1.0	1.0	0.6	0.65	○
				0.4	0.65	○
	SON1616	1.6	1.6	0.6	0.55		●
Cu Lead-flame	SON1212	1.2	1.2	0.4	0.4		●
	SON1216	1.2	1.6	0.4	0.4			●
	SON1616	1.6	1.6	0.4	0.5		○
	SON2222	2.2	2.2	0.5	0.5			●
	QFN2323	2.3	2.3	0.5	0.4					●
	QFN0303	3.0	3.0	0.8	0.5				●	●
	QFN0404	4.0	4.0	0.8	0.5						●
	QFN0505	5.0	5.0	0.8	0.5							○
	QFN0707	7.0	7.0	0.8	0.5								●
	QFN0808	8.0	8.0	0.8	0.5									○
	QFN0909	9.0	9.0	0.8	0.5										○

Flat Leaded Packages

●：In mass production　　○：Under development　　□：Under planning

PKG	PKG Size(mm)			Lead Pitch (mm)	Pin Count
	D	E	A		3	4	5	6	8	10
SOT-89(UPAK)	4.5	2.5	1.5	1.5	●		●
SC-84-5(LUPAK)	5.7	3.7	1.5	2.1			●
SON1408	1.4	0.8	0.6	0.45	●
SON1612	1.6	1.2	0.5	0.5			●	●
SON1626	1.6	2.6	0.75	0.5				●
SON2017	2.0	1.7	0.75	0.65			●	●
SON3024	3.0	2.4	0.75	0.5						●
SON3036	3.0	3.6	0.75	0.65					●

Gull-wing Leaded Packages

●：In mass production　　○：Under development　　□：Under planning

PKG	PKG Size (mm)			Lead Pitch (mm)	Pin Count
	D	E	A		3	4	5	6	8	28	32
(CMPAK)	2.0	1.25	0.9	1.3 (4pin) 0.65 (5,6pin)		● SC-82AB	● SC-88A	● SC-88
SOT(MPAK)	2.9	1.5	1.1	1.9 (3pin) 0.65 (5,6pin)	● SC-59A		● SC-74A	● SC-74
(WMPAK)	2.9	1.8	1.1	0.95				●
MSOP(MMPAK)	2.9	2.9	1.1	0.65					●
SOP	4.85	4.4	1.85	1.27					●
	18.0	8.4	2.1	1.27						●
	20.5	11.3	2.75	1.27							●
SSOP	2.0	2.3	0.8	0.5					●
TSSOP	3.0	4.4	1.0	0.65					●

Low Tharmal Resistance Packages

●：In mass production　　○：Under development　　□：Under planning

TYPE	PKG	PKG Size(mm)			Lead Pitch (mm)	Pin Count
		D	E	A		20	28	36	56	64	80
Lead for Radiation	HQFP	10.0	10.0	2.54	0.65				●
		14.0	14.0	3.15	0.65					●
	HLQFP	7.0	7.0	1.7	0.65		●
Heat Spreader	HSOP	14.1	11.0	3.6	1.27	●		●
	HLQFP	14.0	14.0	1.7	0.5						●
Tab Expose	HTSSOP	14.0	6.1	1.2	0.5				●
	HTQFP	10.0	10.0	1.2	0.5					●

Diode Packages

●：In mass production　　○：Under development　　□：Under planning

PKG	PKG Size(mm)			Pin Count						Lead Frame Material
	D	E	A	2	3	4	5	8	12
MPAK	2.8	2.8	1.1		●	□	●			Cu
CMPAK	2.0	2.1	0.9		●	●				Cu
MOP	4.7	2.8	1.1					●		42Alloy
SRP	3.8	1.6	1.1	●						42Alloy
T-SRP	3.8	1.6	0.9	●						42Alloy
URP	2.5	1.25	0.9	●						Cu
TURP	2.5	1.25	0.55	●						Cu
UFP	1.6	0.8	0.6	●						Cu
SFP	1.4	0.6	0.55	●						Cu
SFP2	1.2	0.6	0.55	●						Cu
EFP	1.0	0.6	0.5	●						Cu
TEFP	1.0	0.6	0.4	●						Cu
MP8	0.8	0.5	0.3	●						Cu
MP6	0.6	0.3	0.3	●						Cu
MFP12	1.4	2.7	0.47						●	Cu

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