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This illustration shows about package size D,E,A in the table.

Diode

●：In mass production　○：Under development　□：Under Planning

TYPE		PKG		PKG Size(mm)			Pin count						Lead Frame Material
				D	E	A	2	3	4	5	8	12
Resin	SMD	SRP		3.8	1.6	1.1	●						42Alloy
		T-SRP		3.8	1.6	0.9	●						42Alloy
		URP		2.5	1.25	0.9	●						Cu
		TURP		2.5	1.25	0.55	●						Cu
		UFP		1.6	0.8	0.6	●						Cu
		SFP		1.4	0.6	0.55	●						Cu
		SFP2		1.2	0.6	0.55	●						Cu
		EFP		1.0	0.6	0.5	●						Cu
		TEFP		1.0	0.6	0.4	●						Cu
		MPAK		2.8	2.8	1.1		●	□	●			Cu
		CMPAK		2.0	2.1	0.9		●	●				Cu
		MOP		4.7	2.8	1.1					●		42Alloy
		MFP12		1.4	2.7	0.47						●	Cu
Glass	SMS	LLD		3.5	φ1.35	-	●
	Insertion	DHD	DO-41	5.2	φ3.0	-	●
			DO-35	4.2	φ2.0	-	●
			DO-34	2.4	φ2.0	-	●
			UMD	2.6	φ1.6	-	●

Lead frame type

●：In mass production　○：Under development　□：Under Planning

TYPE	PKG ( In-house name )	PKG Size(mm)			Pin count
		D	E	A	3	4	5	6	8	10	28
Flat-lead(SON)	SON1408	1.4	0.8	0.6	●
	SON1612	1.6	1.2	0.5			●	●
	SON1626	1.6	2.6	0.75				●
	SON2017	2.0	1.7	0.75			●	●
	SON3024	3.0	2.4	0.75						●
	SON3036	3.0	3.6	0.75					●
Gull-wing	(CMPAK)	2.0	1.25	0.9		● SC-82AB	● SC-88A	● SC-88
	SOT(MPAK)	2.9	1.5	1.1	●		● SC-74A	● SC-74
	MSOP(MMPAK)	2.9	2.9	1.1					●
	SOP	4.85	4.4	1.85					●
		18.0	8.4	2.0							●
	SSOP	2.0	2.3	0.8					●
	TSSOP	3.0	4.4	1.0					●
For Discretet, Power IC(SMD)	SOT89(UPAK)	4.5	2.5	1.5	●		●
	SC84-5(LUPAK)	5.7	3.65	1.5			●

Lead frame MAP type

●：In mass production　○：Under development　□：Under Planning

TYPE	PKG	PKG Size(mm)			Pin count
		D	E	A	8	10	12	16	24	32	48	56
Mold Array	SON2222	2.2	2.2	0.5	●
	QFN0303	3.0	3.0	0.8			●	●
	QFN0404	4.0	4.0	0.8					●
	QFN0505	5.0	5.0	0.8						○
	QFN0707	7.0	7.0	0.8							●
	QFN0808	8.0	8.0	0.8								●

*We can support custom.

QFP type

●：In mass production　○：Under development　□：Under Planning

TYPE	PKG	PKG Size(mm)			Lead Pitch (mm)	Pin count
		D	E	A		32	40	48	56	64	80	100	120	128	144	168	176	208
QFP	LQFP
		7.0	7.0	1.7	0.5			●
					0.65		●
	TQFP
		10.0	10.0	1.2	0.5					●
		12.0	12.0	1.2	0.5						●
		14.0	14.0	1.2	0.4								●
	QFP	10.0	10.0	2.54	0.5					●
					0.65				●
		14.0	14.0	3.1
					0.5							●
					0.65						●
					0.8					●
		14.0	20.0	3.1	0.5									●
					0.65							●
					0.8						●
					1.00					●

High-power type

●：In mass production　○：Under development　□：Under Planning

TYPE	PKG	PKG Size(mm)			Lead Pitch (mm)	Pin count
		D	E	A		20	26	28	36	48	52	56	64	80	92	100
Radiation lead	HSOP	18.4	8.3	3.0	0.8		●
	HQFP	10.0	10.0	2.54	0.65							●
		14.0	14.0	3.15	0.65								●			●
				3.05	0.65					●				●
	HLQFP	7.0	7.0	1.7	0.65			●
Heat spreader	HSOP	14.1	11.0	3.6	1.27	●			●
	HLQFP	14.0	14.0	1.7	0.5									●		●
Tab exposure	HTSSOP	14.0	6.1	1.2	0.5							●
	HTQFP
		10.0	10.0	1.2	0.5								●

Substrate type

●：In mass production　○：Under development　□：Under Planning

*First character of package form name means attachment height

Form Name		Attachment Height A max mm
LFLGA	LFBGA	1.7
TFLGA	TFBGA	1.2
VFLGA	VFBGA	1.0
WFLGA	-	0.8
UFLGA	VFBGA	0.65
XFLGA	XFBGA	0.5

PKG	PKG Size(mm)			Land/Ball Pitch (mm)	Pin count
	D	E	A		44	57	65	85	108	119	128	132	156	164	176	208	256	264	277	281	324	480	676
BGA	4	4	-	0.5	●
	5	5	-	0.5		●
	6	6	-	0.5			●	●
	7	7	-	0.5							●
	8	8	-	0.5								●
	12	12	-	0.8									●
	13	13	-	1.0					●
			-	0.8											●
			-	0.65															●	●
	14	22	-	1.27																	●
	14	14	-	1.0										●
	15	15	-	0.8																		●
	17	17	-	1.0										●		●
	18	18	-	0.65													●	●
	19	19	-	0.8																	●
	27	27	-	1.0																			●

PKG	PKG Size(mm)			Land/Ball Pitch (mm)	Pin count
	D	E	A		56	64	72	80	96	104	113	120	132	144	156	168	176	183	208	242	243	252	304
LGA	5	5	-	0.5	●		●
	6	6	-	0.5		●
	7	7	-	0.5				●		●		●
	8	8	-	0.5									●
			-	0.8				●
	8	12	-	0.8					●
	9	9	-	0.8		●
	9.5	9.5	-	0.65											●
	10	10	-	0.5							●							●
			-	0.8						●
	11	11	-	0.8
	12	12	-	0.5						●							●
			-	0.8
	13	13	-	0.5																			●
			-	0.65													●			●
			-	0.8										●
	14	14	-	0.65																			●
	15	15	-	0.8												●			●
	18	18	-	0.8																		●
	20	20	-	0.8																	●

Tape type

●：In mass production　○：Under development　□：Under Planning

TYPE	tape width
	35mmSW	48mmSW	70mmW
TCP	●	●	●
COF	●	●	●

PKG	PKG Size(mm)			Ball Pitch (mm)	Pin count
	D	E	A		120	184	216	264	352	400	480
T-BGA	13	13	V	0.5		●
	15	15	V	0.5			●
			T	0.8	●
	18	18	V	1.0				●
			T	0.8			●
	21	21	T	0.8				●
	23	23	L	0.8					●
	31	31	-	1.0						●	●

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