We respond to your needs with our wide choice of package products ranging from diodes to ultra-high-pin-count products along with the latest assembly technology.
(* The word package is represented as PKG.)
Small Packages
- Extended lineup of small packages
- Trend of small packages and overview of flat-lead packages
Diode Packages
- Diode packages
IC & LSI Packages
- Extended lineup of IC packages
- Mounting height vs. pin count
- Package volume trend
- Wire bonding
- Technology roadmap
BGA & LGA
- Body size vs Pin count
- About FBGA and LGA
- About T-TFBGA and T-THBGA
- About FCBGA
- About HBGA
- Low-heat-resistant BGA
- About making products thinner
High-power Packages
- Example of High-power package architectures
- QFP High-power design
- HSO High-power design
Tape Implementation Packages
- About TCP
- About COF
